Product Code Database
A printed circuit board ( PCB), also called printed wiring board ( PWB), is a Lamination sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. PCBs are used to connect or "wire" components to one another in an electronic circuit. Electrical components may be fixed to conductive pads on the outer layers, generally by soldering, which both electrically connects and mechanically fastens the components to the board. Another manufacturing process adds vias, metal-lined drilled holes that enable electrical interconnections between conductive layers, to boards with more than a single side.
Printed circuit boards are used in nearly all electronic products today. Alternatives to PCBs include wire wrap and point-to-point construction, both once popular but now rarely used. PCBs require additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Electronic design automation software is available to do much of the work of layout. Mass-producing circuits with PCBs is cheaper and faster than with other wiring methods, as components are mounted and wired in one operation. Large numbers of PCBs can be fabricated at the same time, and the layout has to be done only once. PCBs can also be made manually in small quantities, with reduced benefits. (2025). 9780128124772 ISBN 9780128124772
PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (stacked layers of substrate with copper plating sandwiched between each and on the outside layers). Multi-layer PCBs provide much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface-mount technology. However, multilayer PCBs make repair, analysis, and field modification of circuits much more difficult and usually impractical.
The world market for bare PCBs exceeded US$60.2 billion in 2014, and was estimated at $80.33 billion in 2024, forecast to be $96.57 billion for 2029, growing at 4.87% per annum.
Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1904. Arthur Berry in 1913 patented a print-and-Etching method in the UK, and in the United States Max Schoop obtained a patent to flame-spray metal onto a board through a patterned mask. Charles Ducas in 1925 patented a method of electroplating circuit patterns.
Predating the printed circuit invention, and similar in spirit, was John Sargrove's 1936–1947 Electronic Circuit Making Equipment (ECME) that sprayed metal onto a Bakelite plastic board. The ECME could produce three radio boards per minute.
Around 1943 the United States began to use the technology on a large scale to make for use in World War II. Such fuzes required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be Screenprinting with metallic paint for conductors and carbon material for , with ceramic disc capacitors and subminiature vacuum tubes soldered in place. The technique proved viable, and the resulting patent on the process, which was classified by the U.S. Army, was assigned to Globe Union. It was not until 1984 that the Institute of Electrical and Electronics Engineers (IEEE) awarded Harry W. Rubinstein its Cledo Brunetti Award for early key contributions to the development of printed components and conductors on a common insulating substrate. Rubinstein was honored in 1984 by his alma mater, the University of Wisconsin-Madison, for his innovations in the technology of printed electronic circuits and the fabrication of capacitors.Engineers' Day, 1984 Award Recipients, College of Engineering, University of Wisconsin-Madison This invention also represents a step in the development of integrated circuit technology, as not only wiring but also passive components were fabricated on the ceramic substrate.
Motorola was an early leader in bringing the process into consumer electronics, announcing in August 1952 the adoption of "plated circuits" in home radios after six years of research and a $1M investment. Motorola soon began using its trademarked term for the process, PLAcir, in its consumer radio advertisements. Hallicrafters released its first "foto-etch" printed circuit product, a clock-radio, on November 1, 1952."Topics & Trends of TV Trade." Television Digest 8:44 (November 1, 1952), 10.
Even as circuit boards became available, the point-to-point chassis construction method remained in common use in industry (such as TV and hi-fi sets) into at least the late 1960s. Printed circuit boards were introduced to reduce the size, weight, and cost of parts of the circuitry. In 1960, a small consumer radio receiver might be built with all its circuitry on one circuit board, but a TV set would probably contain one or more circuit boards.
Originally, every electronic component had wire leads, and a PCB had holes drilled for each wire of each component. The component leads were then inserted through the holes and to the copper PCB traces. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the United States Army Signal Corps developed the Auto-Sembly process in which component leads were inserted into a copper foil interconnection pattern and Dip soldering. The patent they obtained in 1956 was assigned to the U.S. Army. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. Soldering could be done automatically by passing the board over a ripple, or wave, of molten solder in a Wave soldering machine. However, the wires and holes are inefficient since drilling holes is expensive and consumes drill bits and the protruding wires are cut off and discarded.
Since the 1980s, surface mount parts have increasingly replaced through-hole components, enabling smaller boards and lower production costs, but making repairs more challenging.
In the 1990s the use of multilayer surface boards became more frequent. As a result, size was further minimized and both flexible and rigid PCBs were incorporated in different devices. In 1995 PCB manufacturers began using microvia technology to produce High-Density Interconnect (HDI) PCBs.
HDI (High Density Interconnect) technology allows for a denser design on the PCB and thus potentially smaller PCBs with more traces and components in a given area. As a result, the paths between components can be shorter. HDIs use blind/buried vias, or a combination that includes microvias. With multi-layer HDI PCBs the interconnection of several vias stacked on top of each other (stacked vías, instead of one deep buried via) can be made stronger, thus enhancing reliability in all conditions. The most common applications for HDI technology are computer and mobile phone components as well as medical equipment and military communication equipment. A 4-layer HDI microvia PCB is equivalent in quality to an 8-layer through-hole PCB, so HDI technology can reduce costs. HDI PCBs are often made using build-up film such as ajinomoto build-up film, which is also used in the production of flip chip packages. (2025). 9781538668146 ISBN 9781538668146 Some PCBs have optical waveguides, similar to optical fibers built on the PCB.
The pattern to be etched into each copper layer of a PCB is called the "artwork". The etching is usually done using photoresist which is coated onto the PCB, then exposed to light projected in the pattern of the artwork. The resist material protects the copper from dissolution into the etching solution. The etched board is then cleaned. A PCB design can be mass-reproduced in a way similar to the way can be mass-duplicated from using a photographic printer.
FR-4 glass epoxy is the most common insulating substrate. Another substrate material is cotton paper impregnated with phenolic resin, often tan or brown.
When a PCB has no components installed, it is less ambiguously called a printed wiring board ( PWB) or etched wiring board. 6 Reasons Why Choose Printed Circuit Boards However, the term "printed wiring board" has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly ( PCA), printed circuit board assembly or PCB assembly ( PCBA). In informal usage, the term "printed circuit board" most commonly means "printed circuit assembly" (with components). The IPC preferred term for an assembled board is circuit card assembly ( CCA),IPC-14.38 and for an assembled backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly". For example, expansion card.
A PCB may be printed with a legend identifying the components, , or identifying text. Originally, silkscreen printing was used for this purpose, but today other, finer quality printing methods are usually used. Normally the legend does not affect the function of a PCBA.
One of the simplest boards to produce is the two-layer board. It has copper on both sides that are referred to as external layers; multi layer boards sandwich additional internal layers of copper and insulation. After two-layer PCBs, the next step up is the four-layer. The four layer board adds significantly more routing options in the internal layers as compared to the two layer board, and often some portion of the internal layers is used as ground plane or power plane, to achieve better signal integrity, higher signaling frequencies, lower EMI, and better power supply decoupling.
In multi-layer boards, the layers of material are laminated together in an alternating sandwich: copper, substrate, copper, substrate, copper, etc.; each plane of copper is etched, and any internal vias (that will not extend to both outer surfaces of the finished multilayer board) are plated-through, before the layers are laminated together. Only the outer layers need be coated; the inner copper layers are protected by the adjacent substrate layers.
The first PCBs used through-hole technology, mounting electronic components by lead inserted through holes on one side of the board and soldered onto copper traces on the other side. Boards may be single-sided, with an unplated component side, or more compact double-sided boards, with components soldered on both sides. Horizontal installation of through-hole parts with two axial leads (such as resistors, capacitors, and diodes) is done by bending the leads 90 degrees in the same direction, inserting the part in the board (often bending leads located on the back of the board in opposite directions to improve the part's mechanical strength), soldering the leads, and trimming off the ends. Leads may be Soldering either manually or by a wave soldering machine.
Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s, and became widely used by the mid-1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much smaller PCB assemblies with much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labor costs and greatly increasing production rates compared with through-hole circuit boards. Components can be supplied mounted on carrier tapes. Surface mount components can be about one-quarter to one-tenth of the size and weight of through-hole components, and passive components much cheaper. However, prices of semiconductor surface mount devices (SMDs) are determined more by the chip itself than the package, with little price advantage over larger packages, and some wire-ended components, such as 1N4148 small-signal switch diodes, are actually significantly cheaper than SMD equivalents.
The cloth or fiber material used, resin material, and the cloth to resin ratio determine the laminate's type designation (FR-4, CEM-1, G-10, etc.) and therefore the characteristics of the laminate produced. Important characteristics are the level to which the laminate is fire retardant, the dielectric constant (er), the dielectric loss (tan δ), the tensile strength, the shear strength, the glass transition temperature (Tg), and the Z-axis expansion coefficient (how much the thickness changes with temperature).
There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton paper), FR-3 (cotton paper and epoxy), FR-4 (woven glass and epoxy), FR-5 (woven glass and epoxy), FR-6 (matte glass and polyester), G-10 (woven glass and epoxy), CEM-1 (cotton paper and epoxy), CEM-2 (cotton paper and epoxy), CEM-3 (non-woven glass and epoxy), CEM-4 (woven glass and epoxy), CEM-5 (woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability.
FR-4 is by far the most common material used today. The board stock with unetched copper on it is called "copper-clad laminate".
With decreasing size of board features and increasing frequencies, small non-homogeneities like uneven distribution of fiberglass or other filler, thickness variations, and bubbles in the resin matrix, and the associated local variations in the dielectric constant, are gaining importance.
The reinforcement type defines two major classes of materials: woven and non-woven. Woven reinforcements are cheaper, but the high dielectric constant of glass may not be favorable for many higher-frequency applications. The spatially non-homogeneous structure also introduces local variations in electrical parameters, due to different resin/glass ratio at different areas of the weave pattern. Non-woven reinforcements, or materials with low or no reinforcement, are more expensive but more suitable for some RF/analog applications.
The substrates are characterized by several key parameters, chiefly thermomechanical (glass transition temperature, tensile strength, shear strength, thermal expansion), electrical (dielectric constant, loss tangent, dielectric breakdown voltage, leakage current, tracking resistance...), and others (e.g. moisture absorption).
At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding Tg then exerts mechanical overload on the board components - e.g. the joints and the vias. Below Tg the thermal expansion of the resin roughly matches copper and glass, above it gets significantly higher. As the reinforcement and copper confine the board along the plane, virtually all volume expansion projects to the thickness and stresses the plated-through holes. Repeated soldering or other exposition to higher temperatures can cause failure of the plating, especially with thicker boards; thick boards therefore require a matrix with a high Tg.
The materials used determine the substrate's dielectric constant. This constant is also dependent on frequency, usually decreasing with frequency. As this constant determines the phase velocity, frequency dependence introduces phase distortion in wideband applications; as flat a dielectric constant vs frequency characteristics as is achievable is important here. The impedance of transmission lines decreases with frequency, therefore faster edges of signals reflect more than slower ones.
Dielectric breakdown voltage determines the maximum voltage gradient the material can be subjected to before suffering a breakdown (conduction, or arcing, through the dielectric).
Tracking resistance determines how the material resists high voltage electrical discharges creeping over the board surface.
Loss tangent determines how much of the electromagnetic energy from the signals in the conductors is absorbed in the board material. This factor is important for high frequencies. Low-loss materials are more expensive. Choosing unnecessarily low-loss material is a common engineering error in high-frequency digital design; it increases the cost of the boards without a corresponding benefit. Signal degradation by loss tangent and dielectric constant can be easily assessed by an eye pattern.
Moisture absorption occurs when the material is exposed to high humidity or water. Both the resin and the reinforcement may absorb water; water also may be soaked by capillary forces through voids in the materials and along the reinforcement. Epoxies of the FR-4 materials are not too susceptible, with absorption of only 0.15%. Teflon has very low absorption of 0.01%. Polyimides and cyanate esters, on the other side, suffer from high water absorption. Absorbed water can lead to significant degradation of key parameters; it impairs tracking resistance, breakdown voltage, and dielectric parameters. Relative dielectric constant of water is about 73, compared to about 4 for common circuit board materials. Absorbed moisture can also vaporize on heating, as during soldering, and cause cracking and delamination,Sood, B. and Pecht, M. 2011. Printed Circuit Board Laminates. Wiley Encyclopedia of Composites. 1–11. the same effect responsible for "popcorning" damage on wet packaging of electronic parts. Careful baking of the substrates may be required to dry them prior to soldering.
Less-often encountered materials:
On the common FR-4 substrates, 1 ounce copper per ft2 (35 μm) is the most common thickness; 2 oz (70 μm) and 0.5 oz (17.5 μm) thickness is often an option. Less common are 12 and 105 μm, 9 μm is sometimes available on some substrates. Flexible substrates typically have thinner metalization. Metal-core boards for high power devices commonly use thicker copper; 35 μm is usual but also 140 and 400 μm can be encountered.
In the US, copper foil thickness is specified in units of per square foot (oz/ft2), commonly referred to simply as ounce. Common thicknesses are 1/2 oz/ft2 (150 g/m), 1 oz/ft2 (300 g/m), 2 oz/ft2 (600 g/m), and 3 oz/ft2 (900 g/m). These work out to thicknesses of 17.05 μm (0.67 thou), 34.1 μm (1.34 thou), 68.2 μm (2.68 thou), and 102.3 μm (4.02 thou), respectively.
| 1/2 oz/ft2 | 150 g/m | 17.05 μm | 0.67 thou |
| 1 oz/ft2 | 300 g/m | 34.1 μm | 1.34 thou |
| 2 oz/ft2 | 600 g/m | 68.2 μm | 2.68 thou |
| 3 oz/ft2 | 900 g/m | 102.3 μm | 4.02 thou |
1/2 oz/ft2 foil is not widely used as a finished copper weight, but is used for outer layers when plating for through holes will increase the finished copper weight Some PCB manufacturers refer to 1 oz/ft2 copper foil as having a thickness of 35 μm (may also be referred to as 35 μ, 35 micron, or 35 mic).
Advanced PCBs may contain components embedded in the substrate, such as capacitors and integrated circuits, to reduce the amount of space taken up by components on the surface of the PCB while improving electrical characteristics.
Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in a straight line from one location/pin to another. This led to very short design times (no complex algorithms to use even for high density designs) as well as reduced crosstalk (which is worse when wires run parallel to each other—which almost never happens in Multiwire), though the cost is too high to compete with cheaper PCB technologies when large quantities are needed.
Corrections can be made to a Multiwire board layout more easily than to a PCB layout.
Before the advent of integrated circuits, this method allowed the highest possible component packing density; because of this, it was used by a number of computer vendors including Control Data Corporation.
Safety Standard UL 796 covers component safety requirements for printed wiring boards for use as components in devices or appliances. Testing analyzes characteristics such as flammability, maximum operating temperature, electrical tracking, heat deflection, and direct support of live electrical parts.
|
|
